Kinetics Database Resources
Title: A model of the chemical processes occurring in CF4/O2 discharges used in plasma etching
Journal: Plasma Chem. Plasma Process.
Reference type: Journal article
Rate expression: k(T) = A (T/298 K)n e-Ea/RT
Rate expression units:
First order: s-1
Second order: cm3/molecule s
Third order: cm6/molecule2 s
R = 8.314472 J / mole K
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